- multi-layer integrated circuit
- wielowarstwowy układ scalony
English-Polish dictionary of Electronics and Computer Science. 2013.
English-Polish dictionary of Electronics and Computer Science. 2013.
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Application-specific integrated circuit — An application specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general purpose use. For example, a chip designed solely to run a cell phone is an ASIC.In contrast, the… … Wikipedia
Hybrid integrated circuit — A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors,… … Wikipedia
Multi-primary color display — is a display that contains an additional primary colors to the standard RGB colors cyan, magenta, and yellow. This technology, in theory, could reproduce all color gamut which the human eye can see. Quattron In 2010, Sharp introduced Quattron, an … Wikipedia
Multi-Chip Module — A Multi Chip Module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. The MCM itself will often be… … Wikipedia
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Integrated Services Digital Network — ISDN redirects here. For other uses, see ISDN (disambiguation). Integrated Services Digital Network (ISDN) is a set of communications standards for simultaneous digital transmission of voice, video, data, and other network services over the… … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Electric double-layer capacitor — Maxwell Technologies MC and BC series supercapacitors (up to 3000 farad capacitance) An electric double layer capacitor (EDLC), also known as supercapacitor, supercondenser, electrochemical double layer capacitor, or ultracapacitor, is an… … Wikipedia
IBM System/360 — The IBM System/360 (S/360) is a mainframe computer system family announced by IBM on April 7, 1964. It was the first family of computers making a clear distinction between architecture and implementation, allowing IBM to release a suite of… … Wikipedia